すべての結果 (1,141)

ヒートシンク Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.

ヒートシンク Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

ソケットとアダプタ USB 2.0 to Serial Adapter DSUB9 based on FTDI FT232

モジュール上コンピュータ - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

モジュール上コンピュータ - COM JUMPtec COMe-mAL10 E2 E3940 4E

モジュール上コンピュータ - COM JUMPtec COMe Mount Kit 5mm 1set

モジュール上コンピュータ - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera

CPU & チップクーラ Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

リボンケーブル / IDCケーブル POWER CABLE FOR LVDS TO DVI ADAPTER

モジュール上コンピュータ - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6100E quad core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

モジュール上コンピュータ - COM JUMPtec ADA-COME-T7 4x10G KR-RJ45 - DEV-TOOL

CPU & チップクーラ Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.