Versarien Low Profile Metallic Foam Heat Sinks offer unparalleled thermal performance in low-profile applications. These heat sinks use VersarienCu™ micro-porous metallic copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the excellent thermal conductivity of copper allow for the height of the heat sinks to be reduced without sacrificing performance. A thin, hard layer of high temperature copper oxide improves the emissivity of the foam, boosting the radiant properties of the heat sink and reducing the temperature of the component. Versarien Low Profile Metallic Foam Heat Sinks are designed for use in passive cooling applications where space is at a premium and performance is crucial. VersarienCu heat sinks can be used to cool any IC (integrated circuit) component.
