Tgon™ 805 Series Thermal Interface Pads

Laird Technologies Tgon™ 805 Series Thermal Interface Pads feature a grain-oriented and plate-like structure that provides a high thermal conductivity. These interface pads include high thermal conductivity of 5W/mK on the Z-axis and 240W/mK on the X-Y-axis. The Tgon 805 series has proprietary pressure-sensitive adhesive on one side that minimizes impact on thermal performance. These interface pads offer >98% graphite, low thermal resistance, and high performance. Laird Technologies Tgon 805 pads are ideal for power conversion equipment, power supplies, large telecommunications switching hardware, and notebook computers.