Tflex™ SF16 Thermal Gap Fillers

Laird Technologies Tflex™ SF16 Thermal Gap Fillers are innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio. The non-silicone-based technology delivers gap fillers with excellent deflection properties, minimizing pressure on components during deflection. Little pressure is required to achieve very low thermal resistance. The thickness of the Tflex SF16 ranges from 0.5mm to 5mm in 0.5mm increments, available as standard.