Laird Technologies Tpcm™ 5000 High-Performance Thermal Interface Material (TIM) features low thermal resistance by coupling high thermal conductivity of 5.3W/mK, minimal bond line thickness, and superior wetting of the mating surfaces. This cost-effective product utilizes a non-silicone formulation that provides a naturally tacky surface. The TIM can be applied with no pump-out occurring and offers easy reworking while delivering long-term reliability. Softening between +50°C to +70°C, the initial pad thickness can decrease to a bond line as thin as 25µm. Laird Technologies Tpcm 5000 TIM has an operating temperature range of -40°C to +125°C. Typical applications include semiconductor packaging, graphics cards, notebooks, servers, IGBTs, automotive, memory modules, and game consoles.
