SX-SDMAX Wi-Fi® 6 Plus Bluetooth® Modules

Silex Technology SX-SDMAX Wi-Fi® 6 Plus BLUETOOTH® Modules support SDIO as the host interface and are powered by NXP's highly integrated IW611 chipset. These dual-band modules deliver better network efficiency, higher throughput, lower latency, and improved range over previous-generation Wi-Fi standards. The SX-SDMAX modules balance power consumption and performance and support a wide temperature range. These SX-SDMAX modules are RoHS compliant and feature single stream, 1x1, and high-density modulation modes (1024 QAM). The SX-SDMAX modules operate within a -40℃ to +85℃ temperature range and a 1.8V to 3.3V power supply range. These wireless LAN modules are ideal for wireless compatibility with a wide range of products, from industrial equipment to small devices.

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数量 RoHS
Silex Technology マルチプロトコルモジュール [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
データシート

Silex Technology マルチプロトコルモジュール [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo
データシート
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Silex Technology ネットワーキングモジュール [Bulk SKU] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector for
データシート

Silex Technology マルチプロトコルモジュール 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module
データシート

Silex Technology マルチプロトコルモジュール 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus BLE v5.3 BR/EDR/LE SDIO 3.0 module Sample
データシート

Silex Technology ネットワーキングモジュール [Bulk SKU] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface for c
データシート