KYOCERA AVX 最新の熱インターフェイス製品
適用されたフィルタ:
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
11/06/2025
11/06/2025
Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.
Laird Technologies Tflex™ HR6.5 Thermal Gap Filler
09/15/2025
09/15/2025
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers
09/09/2025
09/09/2025
Provide high thermal conductivity, low thermal resistance, and high reliability.
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap Fillers
08/25/2025
08/25/2025
Designed to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap Filler
10/25/2024
10/25/2024
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Laird Technologies Tflex SF4 Thermal Gap Fillers
09/10/2024
09/10/2024
Silicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.
Laird Technologies Tflex SF7 Thermal Gap Fillers
09/10/2024
09/10/2024
Innovative, high-performing thermal material with silicone-free construction.
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05/30/2024
05/30/2024
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05/27/2024
05/27/2024
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
01/18/2024
01/18/2024
Features chip sizes ranging from 0603 to 2512.
MG Chemicals Non-Silicone Liquid Thermal Gel
10/30/2023
10/30/2023
1-part gel that offers extreme thermal conductivity and flame retardancy.
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
09/27/2023
09/27/2023
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal Grease
09/13/2023
09/13/2023
High-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.
Laird Technologies CoolZorb 200 Hybrid TIM/EMI Absorbers
09/08/2023
09/08/2023
Hybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
08/03/2022
08/03/2022
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Technologies Tpcm™ 7000 High-Performance TIMs
08/03/2022
08/03/2022
Designed to enhance the cooling of the thermal challenges in electronics.
Laird Technologies Tpcm™ 5000 High-Performance TIM
07/19/2022
07/19/2022
Features low thermal resistance and a non-silicone formulation with a naturally tacky surface.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
07/11/2022
07/11/2022
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.
Laird Technologies Ttape™ 1000A Thermally Conductive Tape
06/03/2022
06/03/2022
Pressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.
Bergquist Company EV Charging Solutions
04/13/2022
04/13/2022
Designed to provide safe charging while protecting EV battery packs from thermal/electrical events.
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