すべての結果 (1,094)

リボンケーブル / IDCケーブル POWER CABLE FOR LVDS TO DVI ADAPTER

CPU & チップクーラ Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

モジュール上コンピュータ - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera

ヒートシンク Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

モジュール上コンピュータ - COM COM Express Type 6 Compact module based on Intel Core i3-1320PRE

モジュール上コンピュータ - COM JUMPtec COMe mini Active Uni Cooler (w/o HSP)

モジュール上コンピュータ - COM COMe-bTL6 W-11865MLE RM590E

モジュール上コンピュータ - COM COM Express Type 7 Basic module based on AMD embedded EPYC 3255 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl).

モジュール上コンピュータ - COM COM HPC Size A module with Intel Core i7-1185GRE Processor, quad core with 2.8GHz (up to 4.4GHz), 12MB L2 cache, GT96 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

モジュール上コンピュータ - COM JUMPtec HSP COMe-cWL6 Cu-core through

モジュール上コンピュータ - COM JUMPtec COMe-mBTc10 E3815 1GB/2S

ヒートシンク HSP COMe-mBT10 through