システム・オン・モジュール - SOM

OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 SiPs

Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 System-in-Packages (SiPs) are a fast, flexible way to develop a system around the AMD Xilinx^® Zynq^® UltraScale+™ MPSoC. These SiPs allow users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSZU3 SiPs integrate the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, with 2GB (16GB) LPDDR4, power management, and other required components into a single BGA package. This integration reduces design effort by months, allowing users to get to market faster or spend time adding more features to products.

部品番号

システム・オン・モジュール - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 100 C

OSDZU3EG1-2G-HFB
Octavo Systems
1: ¥144,296.1
18予想2027/03/30
Mouser 初

メーカ部品番号
OSDZU3EG1-2G-HFB

Mouser 部品番号
415-OSDZU3EG1-2G-HFB

Mouser 初

Octavo Systems

Octavo Systems osdzu3 sips について

データシート

18予想2027/03/30

¥144,296.1

最低： 1
複数： 1

OSDZU3

Standard BGA

XCZU3EG1

2 GB

4.5 V to 5.5 V

CAN, I2C, SPI, UART, USB

- 40 C

+ 100 C

20.5 mm X 40 mm

Tray

システム・オン・モジュール - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40 C to 85 C