MBH7BTZ53-E2

Name: FCL Components MBH7BTZ53-E2
Brand: FCL Components
SKU: 817-MBH7BTZ53-E2
Price: 12015 JPY
Availability: OutOfStock

Mouser #:

817-MBH7BTZ53-E2

Mfr. #:

MBH7BTZ53-E2

Mfr.:

FCL Components

Description:

Bluetooth Modules - 802.15.1 BT iOS Mod Stacking connector w/Antenna

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

More Information

Learn more about FCL Components MBH7BTZ53-E2

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	FCL Components
Product Category:	Bluetooth Modules - 802.15.1
RoHS:
Series:	MBH7BTZ
Protocol:	Bluetooth 2.1 + EDR
Class:	Class 2
Interface Type:	UART
Output Power:	4 dBm
Receiver Sensitivity:	- 87 dBm
Frequency:	2.4 GHz
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Antenna:	Integrated
Brand:	FCL Components
Height:	2.3 mm
Length:	26 mm
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	2.7 V to 3.6 V
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth
Protocol - Sub GHz:	ISM
Sensitivity:	- 87 dBm
Factory Pack Quantity:	1
Subcategory:	Wireless & RF Modules
Width:	19 mm

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Bluetooth® Low Energy Modules

FCL Components Bluetooth® Low Energy (BLE) Modules contain the complete verified and qualified Bluetooth low energy protocol stack, offering flexibility and a high level of customization. The BLE modules are Bluetooth V4.0 single-mode compliant and are housed in small packages. The modules feature built-in MCUs for adding upper layer profiles including private profiles and application code.