New D-Sub Cables
Amphenol Commercial D-Sub Cable Assemblies offer EMI/RFI shielding, a rugged design, and secure mating, making them ideal for environments where reliability and signal integrity are crucial. The series features a current rating of up to 3A and wire gauges of 28AWG, 26AWG, 24AWG, and 20AWG, enabling designers to make selections based on current load, flexibility, and space constraints. Amphenol Commercial D-Sub Cable Assemblies operate within a temperature range of -20°C to +80°C and support moderate power applications. These robust and versatile connectors are ideal for electronics, industrial, and commercial environments. Typical applications include data, communications, instrumentation, set-top boxes, and medical instruments.
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Amphenol D-Sub Cable AssembliesOffers EMI/RFI shielding, a rugged design, secure mating, up to 3A, and 28AWG to 20AWG wire gauges.2026/01/06
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Winchester Interconnect M83513 Micro-D ConnectorsFeature a mechanically robust and durable rectangular form factor and low contact resistance.2025/09/15 -
L-Com Heavy Duty Deluxe D-Sub Cable AssembliesUtilizes 20AWG conductors, enabling maximum current throughput and an extremely durable assembly.2024/12/14 -
L-Com Data Interconnect SolutionsConsists of D-sub adapters, D-sub cable assemblies, and D-sub connectors.2024/12/12 -
Amphenol SnapLock ConnectorsConsist of two connection cables and two connecting cables and are available in three lengths.2024/11/26 -
MicroStrain by HBK 3DM-GV7 Tactical Grade Ruggedized IMUsFeature a precision-machined aluminum enclosure and are tested to an IP68 rating.2024/04/08 -
TE Connectivity AMPLIMITE D-Subminiature Cable AssembliesDesigned for the AMPLIMITE D-Subminiature connector family, widely used in electronic industries.2024/03/08 -
Cinch Connectivity Solutions Space Screened Micro-D Cable AssembliesConforms to M83513 requirements and suitable for military, defense, and satellite applications.2024/02/01 -
Cinch Connectivity Solutions Micro-D Jumper AssembliesDesigned for rugged, high-performance, and densely compacted interconnect applications.2023/08/28