TDK CGA Conductive Epoxy Automotive-Rated MLCCs

TDK CGA Conductive Epoxy Automotive-Rated MLCCs are conductive glue-mounted rather than solder-mounted, making them ideal for high-temperature environments that require high reliability, such as automotive applications. These AEC-Q200 devices allow for more flexibility during periods of expansion and contraction. The use of a non-solder attachment reduces the thermal expansion differences between the substrate, MLCC, and solder fillet. TDK CGA MLCCs are also used in applications that cannot be subjected to the heat of the solder paste mounting process, such as LCD panels, organic EL and LED displays, and CCD devices, which are especially sensitive to high temperatures.

Features

  • AgPdCu termination for conductive glue mounting
  • Improved mechanical / thermal strength when used with conductive glue
  • Reduced risk of silver migration
  • AEC-Q200 compliant
  • RoHS, WEE, and REACH compliant

Applications

  • Transmission controls
  • Engine sensor modules
  • Automotive power trains
  • Anti-Lock Breaking Systems
  • Application requiring conductive glue-mounting methods

Videos

公開: 2012-05-30 | 更新済み: 2022-03-11