Texas Instruments CC2560 Bluetooth Smart Ready Controllers

Texas Instruments CC2560 Bluetooth Smart Ready Controller is a complete BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, the CC2560 device brings a product-proven solution that supports 4.0 dual mode (BR/EDR/LE) protocols.

TI's power-management hardware and software algorithms provide significant power savings in all commonly used BR/EDR/LE modes of operation. When coupled with an MCU device, this HCI device provides best-in-class RF performance for mobile phone accessories, sports and fitness applications, wireless audio solutions, remote controls, and toys.

With transmit power and receive sensitivity, TI CC2560 provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software stack available from TI is pre-integrated with TI's MSP430 and Stellaris MCUs.

Features

TI’s Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants:
- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer
Highly Optimized for Low-Cost Designs:
- Single-Ended 50Ω RF Interface
- Package Footprint: 76 Terminals, 0.6mm Pitch, 8mm x 8mm mrQFN
BR/EDR Features Include:Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µLaw, and Transparent (Uncoded)
- CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance
- Built-In Coexistence and Prioritization Handling for BR/EDR and LE

Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power Up to +10dBm
- –95dbm Typical RX Sensitivity
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
  - UART Transport Layer (H4) With Maximum Rate of 4Mbps
  - Three-Wire UART Transport Layer (H5) With Maximum Rate of 4Mbps (CC2560B and
    CC2564B Only)
- Fully Programmable Digital PCM-I²S Codec Interface
Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM^{® Cortex®-M3} and Cortex^®-M4 MCUs
CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
Device Pin-to_pin Compatible with Previous Devices or Modules