特徴
- Average forward current: IF(AV) ≤8A
- Reverse voltage: VR ≤100V
- Low leakage current due to high Schottky barrier technology
- Low forward voltage
- High power capability due to clip-bonding technology and heat sink
- High temperature Tj ≤175°C
- AEC-Q101 qualified
- Small and thin SMD power plastic package, typical height 0.78mm

