すべての結果 (1,058)

モジュール上コンピュータ - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

モジュール上コンピュータ - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

開発基板およびキット - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

ヒートシンク HSP COMe-bSL6 Cu-core threaded

CPU & チップクーラ Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

ヒートシンク Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

ヒートシンク * Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

ヒートシンク HSP COMe-mAL10 E2 slim thread

モジュール上コンピュータ - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

モジュール上コンピュータ - COM JUMPtec COMe Eval Carrier2 T6 5mm

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

開発ボードとキット - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)