congatec 組み込みソリューション

モジュール上コンピュータ - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

モジュール上コンピュータ - COM JUMPtec COMe-mBTi10 E3827 2GB

モジュール上コンピュータ - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

開発基板およびキット - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

モジュール上コンピュータ - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.

モジュール上コンピュータ - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

モジュール上コンピュータ - COM COMe-bTL6 W-11865MLE RM590E

開発ボードとキット - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

モジュール上コンピュータ - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

モジュール上コンピュータ - COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)

モジュール上コンピュータ - COM JUMPtec COMe-mBTi10 E3815 1E/2S

モジュール上コンピュータ - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran